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Datesort icon Title
2013/12/13 - 14:30 Mit heterogener 3D-Integration zum „Superchip“ (elektroninet 11.12.2013)
2013/06/10 - 08:40 5th Design for 3D Silicon Integration (D43D) in Grenoble (24.-26.6.2013)
2013/06/07 - 08:53 Fourth IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits 3D-TEST
2013/02/04 - 09:37 Forscher bauen neuartigen 3D-Mikrochip
2012/11/07 - 08:57 EE Times 40th Anniversary: From 3-D chips to cognitive computing
2012/05/03 - 09:12 Chip execs see 20 nm variants, 3-D ICs ahead
2012/04/19 - 10:37 Sachsen und Abu-Dhabi forschen gemeinsam an 3D-Chips
2012/04/17 - 15:16 EDPS: 3D ICs
2012/04/13 - 09:59 Synopsys 3D-IC-lnitiative
2012/02/02 - 12:01 CEA-Leti launches Open 3D initiative to include design, layout, testing and packaging
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The NEEDS project (project label 16M3090) is supported within the Research Programme ICT 2020 by the German Federal Ministry of Education and Research (BMBF).

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