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2013/12/13 - 14:30 |
Mit heterogener 3D-Integration zum „Superchip“ (elektroninet 11.12.2013) |
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2013/06/10 - 08:40 |
5th Design for 3D Silicon Integration (D43D) in Grenoble (24.-26.6.2013) |
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2013/06/07 - 08:53 |
Fourth IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits 3D-TEST |
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2013/02/04 - 09:37 |
Forscher bauen neuartigen 3D-Mikrochip |
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2012/11/07 - 08:57 |
EE Times 40th Anniversary: From 3-D chips to cognitive computing |
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2012/05/03 - 09:12 |
Chip execs see 20 nm variants, 3-D ICs ahead |
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2012/04/19 - 10:37 |
Sachsen und Abu-Dhabi forschen gemeinsam an 3D-Chips |
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2012/04/17 - 15:16 |
EDPS: 3D ICs |
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2012/04/13 - 09:59 |
Synopsys 3D-IC-lnitiative |
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2012/02/02 - 12:01 |
CEA-Leti launches Open 3D initiative to include design, layout, testing and packaging |
